G4A01084C Datasheet, PDF (2/22 Pages) List of Unclassifed Manufacturers – MICROTEMP Thermal Cutoffs INTRODUCTION

MICROTEMP^® G4, G6 & G7 Series TCO
Before Operation
After Operation
THERMAL
PELLET
COMPRESSION
SPRING
TRIP SPRING
CASE AND LEAD
ASSEMBLY
DISCS
STAR CONTACT
COMPRESSION
SPRING
TRIP SPRING
CASE AND LEAD
ASSEMBLY
DISCS
STAR CONTACT
CERAMIC
BUSHING
EPOXY
SEAL
ISOLATED
LEAD
Grey area shows
current path
CERAMIC
BUSHING
EPOXY
SEAL
ISOLATED
LEAD
Grey area shows opened or
broken current path
Figure 1
MICROTEMP^® G5 & G8 Series TCO
Before Operation
After Operation
THERMAL
PELLET
CASE AND LEAD
ASSEMBLY
COMPRESSION
SPRING
TRIP SPRING
DISCS
STAR CONTACT
CERAMIC
BUSHING
FLOATING
CONTACT
ISOLATED LEAD
EPOXY
SEAL
Grey area shows
current path
COMPRESSION
SPRING
CASE AND LEAD
ASSEMBLY
DISCS
TRIP SPRING
CERAMIC
BUSHING
EPOXY
SEAL
STAR CONTACT
FLOATING
CONTACT
ISOLATED LEAD
Grey area shows opened or
broken current path
136
Figure 2