M10382 Datasheet, PDF (6/27 Pages) List of Unclassifed Manufacturers – GPS RADIONOVA RF Antenna Module

®
m2m
GPS RADIONOVA^® RF Antenna Module
Part No. M10382
Quality and Environmental Specifications
Test
Standard
Parameters
PCB Inspection
IPC-6012B, Class 2. Qualification and
Performance Specification for Rigid Printed
Boards - Jan 2007
Assembly
Inspection
IPC-A-610-D, Class 2 “Acceptability of
electronic assemblies”
Temperature
Range
ETSI EN 300 019-2-7 specification T 7.3
-30 °C, +25 °C, +85 °C, operating
Damp Heat
ETSI EN 300 019-2-7 specification T 7.3
+70 °C, 80% RH, 96 hrs, non-
operating
Thermal Shock
ETSI EN 300 019-2-7 specification T 7.3 E -40 °C ... +85 °C, 200 cycles
Vibration
ISO16750-3
Random vibration, 10~1000Hz,
27.8m/s², 8hrs/axis, X, Y, Z 8hrs for
each 3 axis non-operating
Shock
ISO16750-3
Half-sinusoidal 50g, 6ms, 10time/face,
±X, ±Y and ±Z non-operating
Free Fall
ISO16750-3
1m height, 2 drops on opposite side
ESD Sensitivity
JEDEC, JESD22-A114 ESD Sensitivity
+2000V - Human hand assembly
Testing Human Body Model (HBM). Class 2
JEDEC, JESD22-A115 ESD Sensitivity
Testing Machine Model (MM), Class B
+200V - Machine automatic final
assembly
Shear
IEC 60068-2-21, Test Ue3: Shear
Force of 5N applied to the side of the
PCB
Moisture/Reflow
Sensitivity¹
IPC/JEDEC J-STD-020D.1
MSL3
Storage (Dry
Pack)¹
IPC/JEDEC J-STD-033C
MSL3
Solderability
EN/IEC 60068-2-58 Test Td
More than 90% of the electrode
should be covered by solder. Solder
temperature 245 °C ± 5 °C
1 _{Moisture Sensitivity}
Antenova ships all devices dry packed in trays with desiccant and moisture level indicator sealed in an air tight package.
If on receiving the goods the moisture indicator is pink in color or a puncture of the air tight seal packaging is observed,
then follow J-STD-033 “Handling and Use of Moisture/Reflow Sensitive Surface Mount Devices”.
Please note it is a required process for the modules to be pre-baked before reflow for 3 hours at 125ºC. This
is due to the integrated antenna. The module can be baked in trays that they come packaged in. When baking,
stack no more than 3 trays high to ensure even temperature distribution.
Storage (Dry Packed)
The M10382 modules can be stored for up to 12 months from the date shown on the bag seal when stored in a non-
condensing atmospheric environment of <40°C/90% RH.
Storage (Out of Bag)
The M10382 modules meet MSL Level 3 of the JEDEC specification J-STD-020D - 168 hours Floor Life (out of bag) ≤30
°C/60% RH. After opening, all modules must complete the pre-bake process and all solder reflow processing prior to
expiry of the stated floor life. If the stated floor life expires prior to reflow process then follow J-STD-033 “Handling and
Use of Moisture/Reflow Sensitive Surface Mount Devices”.
Antennas for Wireless M2M Applications

Product Specification 11MD-0043-4-PS