M10382 Datasheet, PDF (23/27 Pages) List of Unclassifed Manufacturers – GPS RADIONOVA RF Antenna Module

®
m2m
Reflow Soldering
GPS RADIONOVA^® RF Antenna Module
Part No. M10382
Placement
Typical placement systems used for any BGA/LGA package are acceptable. Recommended nozzle diameter
for placement: 5mm
Moisture Preconditioning
Before submitting the M10382 module to the reflow soldering process, it is mandatory to bake the module at
125 ºC for 3 hours. If the module is not baked, it could develop defects during the reflow soldering process; in
particular, bubbles or other defects could appear on the metallised pattern of the antenna.
Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the
soldering process has taken place. An example of suitable soldering paste is Alpha OM350.
Soldering
The recommended soldering profile for M10382 is show below. However, it is the responsibility of the Contract
manufacturer to determine the exact reflow profile used, taking into consideration the parameters of the host
PCB, solder paste used, etc.
Profile Feature
Temperature (Ts) Min
Pre-Heat
Temperature (Ts) Max
Time (ts)
Reflow
Liquidus Temperature - (Tl)
Time (tl)
Peak Package Body Temperature (Tp)
Time within 5°C of peak temp (tp)
Average Ramp up rate - Ts(max) to (Tp)
Ramp Down Rate
Pb-Free Solder
130°C
220°C
<150s
220°C
45-90s
245°C
30s
3°C/s
6°C/s max
Example Reflow profile
Antennas for Wireless M2M Applications
23
Product Specification 11MD-0043-4-PS