HPB8F-4K3RGBX Datasheet, PDF (6/20 Pages) List of Unclassifed Manufacturers – FULL COLOR PRODUCTS SPECIFICATION

2DEVICE NO:HPB8F-4K3RGBx
2ABSOLUTE MAXIMUM RATINGS
PARAMETER
Continuous Forward Current
SYMBOL
IF
MAX. RATING
Red Green Blue
350 350 350
TA=25°C
UNIT
mA
Peak Forward Current *1
IFM
550 500 500
mA
LED Junction Temperature
Tj
120 135 135
°C
Operating Temperature
Topr
-40 ~ +110
°C
Storage Temperature
Tstg
-40 ~ +120
°C
Manual Soldering Temperature 260 °C for 5 seconds max. *2 *3
*1.Duty Ratio=0.1%,Pulse Width=10us.
*2.Iron soldering high temperature will not cause damage to the dice. But be aware of the high temperature
will not only make the epoxy soften but also cause the lead moving and the gold wire broken and even open.
So before returning to the normal temperatures PLEASE AVOID any serious pressure on the top of epoxy
and lead.
*3.Measured at leads, lens temperature must not exceed 120ºC during lead soldering and slug attach. Soldering
by general IR reflow, Vapor phase reflow and wave soldering on this system product is unsuitable. Selective
heating of the leads limit lead soldering, such as by hot bar reflow, fiber focussed IR, or hand soldering. The
package back plane (slug) may not be attached by soldering, but rather with a thermally conductive adhesive.
Electrical insulation between the slug and the board is necessary. Please consult welding matters needing
attention.
HUEY JANN ELECTRONICS INDUSTRY CO., LTD.
No.27 Line 466 Sec.2,Canng-nan Rd. Wu-chi Town Taichung Shien, Taiwan, R.O.C.
TEL:[phone] FAX:[phone]
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