HPB8F-4K3RGBX Datasheet, PDF (17/20 Pages) List of Unclassifed Manufacturers – FULL COLOR PRODUCTS SPECIFICATION

2 Heat Plate Soldering Condition
a. Soldering Process for Solder Paste
2DEVICE NO:HPB8F-4K3RGBx
Heat conduction rubber
PCB
Use Solder Mask to print Solder
Place Emitter on PCB.
Paste on PCB.
1.The Solder Paste sould be melted within 10 seconds.
2.Take out PCB out from Heat Plate within 15 seconds.
b. Soldering Process for Solder Wire
Heat Plate
Put PCB on Heat Plate until
Solder Paste melt.
Heat conduction rubber
PCB
Heat Plate
Heat Plate
Solder Wire
Heat Plate
Put PCB on Heat Plate.
Place Solder Wire to the solder
Put Emitter on PCB. Take the
pad of PCB.
PCB out from Heat Plate within
10 seconds.
NOTE:
1.Heat plate temperature: 230^oC max for Lead Solder and 260 ^oC max for Lead-Free Solder.
2.When soldering, do not put stress on the LEDs during heating.
3.After soldering, do not warp the circuit board.
HUEY JANN ELECTRONICS INDUSTRY CO., LTD.
No.27 Line 466 Sec.2,Canng-nan Rd. Wu-chi Town Taichung Shien, Taiwan, R.O.C.
TEL:[phone] FAX:[phone]
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