HPB8F-4K3RGBX Datasheet, PDF (18/20 Pages) List of Unclassifed Manufacturers – FULL COLOR PRODUCTS SPECIFICATION

2 Soldering Process For Hot Bar
2DEVICE NO:HPB8F-4K3RGBx
Heat conduction rubber
PCB
Thermal Conductive Glue
Dispensing
Put Emitter on the PCB.
Hot Bar
Hot Bar soldering of High
Power Emitter
NOTE:
1.Hot Bar temperature: 230^oC max for Lead Solder and 260 ^oC max for Lead-Free Solder.
2.When soldering, do not put stress on the LEDs during heating.
3.After soldering, do not warp the circuit board.
2 Manual Hand Soldering
PCB
Thermal Conductive Glue
Heat conduction rubber
Solder Wire
Soldering Lron
Place Thermal Conductive Glue
on the PCB.
Place Emitter on the PCB.
Use Soldering Iron to solder the leads
of Emitter within 5 seconds.
1.Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.
2.Avoiding damage to the emitter or to the PCB dielectric layer. Damage to the epoxy layer can cause
3.Do not let the solder contact from solder pad to back-side of PCB. This one will cause a short circuit and
damage emitter.
HUEY JANN ELECTRONICS INDUSTRY CO., LTD.
No.27 Line 466 Sec.2,Canng-nan Rd. Wu-chi Town Taichung Shien, Taiwan, R.O.C.
TEL:[phone] FAX:[phone]
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