RFD21733 Datasheet, PDF (53/76 Pages) List of Unclassifed Manufacturers – Compliance Approved 2.4 GHz RF Transceiver Modules with Built-In RFDP8 Application Protocol

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7/10/2011 1:40 AM
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RFD21733 • FCC • IC
RFD21743 • FCC
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RFDP8
RF Module
RFD21733
RFD21735
RFD21737
RFD21738
RFD21739
RFDP8
RFDANT
RFD21742
RFD21743
RFD21772
RFD21773
KEYFOBs
Washing
The RFD21733 and RFD21735 are NOT washable.
Use no-clean flux, leaded or lead-free. If you attempt to wash the modules, water will enter beneath
(inside) the RF shield and get trapped, which may cause device failure or damage once powered on.
There is no way to make sure all water has been removed before powering the module so do NOT wash
the modules.
Potting, Encapsulation and Conformal Coating
Do NOT pot or conformal coat the RFD21733 or RFD21735.
If you plan on encapsulating the RFD21733 or RFD21735 in a potting compound or conformal coating,
you must assure that the compound in liquid or solid form does not enter under the shield where there
are sensitive RF components. Some of the capacitive values are as low as half a picofarad and sensitive
to contacting materials such as potting compounds. There are potting compounds and conformal
coatings which have very good dielectric constants and are suitable for 2.4 GHz potting applications,
however, when you apply any of these, they were accounted for in the circuit design and might reduce
performance of the device or all together cause it not to function.
Applying any compound, conformal coating or potting directly to the module voids any and all
warranty and support service.
If your application requires 100% sealing of the module, there is a way to do this very successfully
without impacting the module performance. Simply place the module on your PCB. Place a plastic
cover over the module (like a hat), make the cover large enough to cover the whole module. Apply glue
around the bottom perimeter of the cover where it sits on the PCB. This allows the module to function in
free airspace while there is a complete seal around it. This information is only for reference and you
should do your own testing with your application to find the best suitable fit for your own design.
Reflow Profile
Use standard lead-free or leaded reflow profile for the RFD21733 and RFD21735. Your CM (Contract
Manufacturer) should profile this module along with your PCB and all other parts on it through their
reflow oven to properly set a profile suitable for all the parts on the board combined.
USE CAUTION: If you are building a double-sided placement board, place this device last so it will not
be subjected to being reflowed upside-down.
As with building any RF devices, you should always build a small quantity through your production
process, test and verify, then increase your quantities to make sure the process is not harmful to the
performance of your RF system. This is true with any RF system, including use of these modules.
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