TC1202 Datasheet, PDF (4/4 Pages) List of Unclassifed Manufacturers – Super Low Noise GaAs FETs

TC1202
SMALL SIGNAL MODEL, V_DS = 4 V, I_DS = 25 mA
SCHEMATIC
Lg
Rg
Cgd
Cgs
Gm
Cds
Ri
T
Rs
Ls
Rd Ld
Rds
PARAMETERS
Parameters
Parameters
Lg
0.04473 nH ^Rs
Rg
0.79 Ohm ^Ls
Cgs
0.361 pF ^Cds
Ri
1.47 Ohm ^Rds
Cgd
0.0310 pF ^Rd
Gm
94.9 mS ^Ld
T
2.13 psec
1.12 Ohm
0.0005 nH
0.0838 pF
193.0 Ohm
0.920 Ohm
0.0242 nH
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290°C ± 5°C; Handling Tool:
Tweezers; Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220°C to 250°C; Bond Tip Temperature: 150°C; Bond
Force: 20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at
all stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC., 90 Dasoong 7^th Road, Tainan Science-Based Industrial Park, Shanhua Jen, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: [phone]
Fax: [phone]
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