FGSD12SR6003A Datasheet, PDF (39/41 Pages) List of Unclassifed Manufacturers – 3-14.4Vdc Input, 3A, 0.45-5.5Vdc Output

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FGSD12SR6003*A
3-14.4Vdc Input, 3A, 0.45-5.5Vdc Output
Surface Mount Information
Pick and Place
The 3A Digital Tomodachi modules use an open
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well
as safety standards, and is able to withstand reflow
temperatures of up to 300°C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Variables such as
nozzle size, tip style, vacuum pressure and
placement speed should be considered to optimize
this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The
maximum nozzle outer diameter, which will safely fit
within the allowable component spacing, is 7mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on
the bottom side of a customer board. If such an
assembly is attempted, components may fall off the
module during the second reflow process.
Lead Free Soldering
The Digital 3A modules are lead-free (Pb-free) and
RoHS compliant and are both forward and backward
compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below
may result in the failure of or cause damage to the
modules and can adversely affect long-term
reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 5-2).
The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig-51. Soldering
outside of the recommended profile requires testing
Preliminary Data Sheet
to verify results and performance.
It is recommended that the pad layout include a test
pad where the output pin is in the ground plane. The
thermocouple should be attached to this test pad
since this will be the coolest solder joints. The
temperature of this point should be:
Maximum peak temperature is 260 C.
Minimum temperature is 235 C.
Dwell time above 217 C: 60 seconds minimum
Dwell time above 235 C: 5 to 15 second
MSL Rating
The 3A Digital Tomodachi modules have a MSL
rating of 2a.
Storage and Handling
The recommended storage environment and
handling procedures for moisture-sensitive surface
mount packages is detailed in J-STD-033 Rev. A
(Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These
sealed packages should not be broken until time of
use. Once the original package is broken, the floor
life of the product at conditions of  30°C and 60%
relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed
SMT packages will be a minimum of 12 months from
the bag seal date, when stored at the following
conditions: < 40°C, < 90% relative humidity.
300
Per J-STD-020 Rev. C
Peak Temp 260°C
250
200
150
Heating Zone
1°C/ Se cond
100
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
50
0
Reflow Time (Seconds)
Fig-51: Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing.
The result of inadequate cleaning and drying can
affect both the reliability of a power module and the
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Ver 1.6 May. 8, 2013