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AT25BCM512B_12 Datasheet, PDF (31/34 Pages) List of Unclassifed Manufacturers – 512-Kilobit 2.7-volt Minimum SPI Serial Flash Memory
16. Packaging Information
16.1 8MA3 – UDFN
B
8
7
6
5
AT25BCM512B [Preliminary]
A
1.50 Ref.
e
5
8
D2
PIN 1 ID
1
2
3
4
D
A1
// ccc C
8X
eee C
C
0.127 Ref.
Notes: 1. All dimensions are in mm. Angles in degrees.
2. Coplanarity applies to the exposed pad as well
as the terminals. Coplanarity shall not exceed 0.05 mm.
3. Warpage shall not exceed 0.05 mm.
4. Package length/package width are considered as
special characteristic.
5. Refer to Jede MO-236/MO-252
R0.10
L3
L
4
1
b
8X
0.10mm C AB
SYMBOL
A
A1
b
D
D2
E
E2
e
L
L3
ccc
eee
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
0.45
0.00
0.20
1.95
1.50
2.95
0.10
–
0.40
0.30
–
–
NOM
–
–
–
2.00
1.60
3.00
0.20
0.50
0.45
–
–
–
MAX
0.60
0.05
0.30
2.05
1.70
3.05
0.30
–
0.50
0.40
0.05
0.05
NOTE
Package Drawing Contact:
contact@adestotech.com
TITLE
GPC
8MA3, 8-pad, 2 x 3 x 0.6 mm Body, 0.5 mm Pitch,
1.6 x 0.2 mm Exposed Pad, Saw Singulated
Thermally Enhanced Plastic Ultra Thin Dual
YCQ
Flat No Lead Package (UDFN/USON)
8/8/08
DRAWING NO. REV.
8MA3
A
31
3704BX–DFLASH–11/2012