M10478 Datasheet, PDF (25/30 Pages) List of Unclassifed Manufacturers – GPS RADIONOVA® RF Antenna Module

®
m2m
Reflow Soldering
GPS RADIONOVA^® RF Antenna Module
Part No. M10478
Placement
Typical placement systems used for any BGA/LGA package are acceptable. Recommended nozzle diameter
for placement: 5mm
Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the
soldering process has taken place. An example of suitable soldering paste is Alpha OM350.
Soldering
The recommended soldering profile for M10478 is shown below. However, it is the responsibility of the
Contract Manufacturer to determine the exact reflow profile used, taking into consideration the parameters of
the host PCB, solder paste used, etc.
Profile Feature
Temperature (Ts) Min
Pre-Heat
Temperature (Ts) Max
Time (ts)
Reflow
Liquidus Temperature - (Tl)
Time (tl)
Peak Package Body Temperature (Tp)
Time within 5°C of peak temp (tp)
Average Ramp up rate - Ts(max) to (Tp)
Ramp Down Rate
Pb-Free Solder
130°C
220°C
<150s
220°C
45-90s
245°C
30s
3°C/s
6°C/s max
Example Reflow profile
The Pb Free Process-Package Peak Reflow Temperature is 260ºC.
Exceeding the maximum soldering temperature could permanently damage the module.
Antennas for Wireless M2M Applications
25
Product Specification 12MD-0050-2-PS