M10477 Datasheet, PDF (25/29 Pages) List of Unclassifed Manufacturers – GPS RADIONOVA® RF Antenna Module

®
m2m
Reflow Soldering
GPS RADIONOVA^® RF Antenna Module
Part No. M10477
Placement
Typical placement systems used for any BGA/LGA package are acceptable. Recommended nozzle diameter
for placement: 5mm
Moisture Preconditioning
T _{Before submitting the M10477 module to the reflow soldering process, it is mandatory to bake the module at}
125 ºC for 3 hours. If the module is not baked, it could develop defects during the reflow soldering process; in
F _{particular, bubbles or other defects could appear on the metallised pattern of the antenna.}
A _{Soldering Paste}
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the
R _{soldering process has taken place. An example of suitable soldering paste is Alpha OM350.}
D _Soldering
The recommended soldering profile for M10477 is show below. However, it is the responsibility of the Contract
Y _{manufacturer to determine the exact reflow profile used, taking into consideration the parameters of the host}
PCB, solder paste used, etc.
R _{Profile Feature}
A _{Temperature (Ts) Min}
IN ^Pre-Heat
Temperature (Ts) Max
Time (ts)
IM ^Reflow
Liquidus Temperature - (Tl)
Time (tl)
Peak Package Body Temperature (Tp)
L _{Time within 5°C of peak temp (tp)}
E _{Average Ramp up rate - Ts(max) to (Tp)}
PR ^{Ramp Down Rate}
Pb-Free Solder
130°C
220°C
<150s
220°C
45-90s
245°C
30s
3°C/s
6°C/s max
Antennas for Wireless M2M Applications
25
Product Specification 12MD-0049-0.6-PS