RFM75 Datasheet, PDF (2/27 Pages) List of Unclassifed Manufacturers – Low Power High Performance 2.4 GHz GFSK Transceiver

RFM75 V1.0
Table of Contents
1 General Description ................................................................................................................. 3
2 Abbreviations .......................................................................................................................... 4
3 Pin Information ....................................................................................................................... 5
4 State Control ........................................................................................................................... 6
4.1 State Control Diagram ............................................................................................................... 6
4.2 Power Down Mode.................................................................................................................... 7
4.3 Standby-I Mode ......................................................................................................................... 7
4.4 Standby-II Mode........................................................................................................................ 7
4.5 TX Mode ................................................................................................................................... 7
4.6 RX Mode ................................................................................................................................... 8
5 Packet Processing .................................................................................................................... 8
5.1 Packet Format............................................................................................................................ 8
5.1.1 Preamble........................................................................................................................... 9
5.1.2 Address............................................................................................................................. 9
5.1.3 Packet Control .................................................................................................................. 9
5.1.4 Payload ........................................................................................................................... 10
5.1.5 CRC................................................................................................................................ 10
5.2 Packet Handling ...................................................................................................................... 10
6 Data and Control Interface .................................................................................................... 11
6.1 TX/RX FIFO ........................................................................................................................... 11
6.2 Interrupt ................................................................................................................................... 11
6.3 SPI Interface ............................................................................................................................ 12
6.3.1 SPI Command ................................................................................................................ 12
6.3.2 SPI Timing ..................................................................................................................... 13
7 Register Map ......................................................................................................................... 15
7.1 Register Bank 0 ....................................................................................................................... 15
7.2 Register Bank 1 ....................................................................................................................... 21
8 Electrical Specifications ......................................................................................................... 22
9 Typical Application Schematic............................................................................................... 23
10 Package and Die Bonding Information................................................................................... 24
10.1 Package Information ........................................................................................................... 24
10.2 Die Bonding Information .................................................................................................... 25
10.3 PCB Bonding diagram ........................................................................................................ 27
11 Order Information ................................................................................................................. 28
12 Contact Information .............................................................................................................. 29
13 Update History ...................................................................................................................... 30
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