YS05S16-0G Datasheet, PDF (17/23 Pages) List of Unclassifed Manufacturers – GPS Module TC6000GN-P1

GPS Module TC6000GN-P1
Datasheet V022
confidential information preliminary specification
16 RECOMMENDED SOLDERING REFLOW PROFILE
T[°C]
300
200
160°C  190°C 120 sec
reflow solder
260°C max
250°C for 10 sec max
230°C for 40 sec max
100
100
200 t[sec]
Notes:
1. TC6000GN-P1 should be soldered in upright soldering position. In case of head-over soldering, please
prevent shielding / TC6000GN-P1 Module from falling down.
2. Do never exceed maximum peak temperature
3. Reflow cycles allowed : 1 time
4. Do not solder with Pb-Sn or other solder containing lead (Pb)
5. This device is not applicable for flow solder processing
6. This device is not applicable for solder iron process
17
© GNS-GmbH 2011
V 0.22, Sep5^th 2012