TCM-BF537 Datasheet, PDF (8/37 Pages) List of Unclassifed Manufacturers – Bluetechnix Mechatronische Systeme GmbH

1 Introduction
The TCM-BF537 is a chip size Core Module designed for industrial temperature range and volume production. It
combines power supply, RAM and FLASH into a module as small as a chip package. Different connector options (Ball
Grid Array (BGA), Border Pads (BP) and Connectors) provides solutions for all possible requirements.
1.1 Overview
The Core Module TCM-BF537 consists of the following components shown in Figure 1-1.
Figure 1-1: Main Components of the TCM-BF537 Core Module
 Analog Devices Blackfin Processor BF537
o ADSP-BF537BBCZ-5A, 500MHz (-40°-85°C)
32 MB SDRAM
o SDRAM Clock up to 133MHz
o See chapter 8 Production Report
Up to 64 MB of Byte Addressable Flash
o See chapter 8 Production Report
o Additional flash memory upon request: It can be connected through the expansion board as
parallel flash using asynchronous chip select lines or as SPI flash.
Low Voltage Reset Circuit
o Resets module if power supply goes below 2.93V.
Dynamic Core Voltage Control
o Core voltage adjustable by setting software registers on the Blackfin processor
o Core voltage range: 0.8 – 1.32V
TCM‐BF537 v1.x‐Hardware User Manual
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