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TCM-BF537 Datasheet, PDF (32/37 Pages) List of Unclassifed Manufacturers – Bluetechnix Mechatronische Systeme GmbH
5 Application Example Schematics
In the following two examples connection of a Physical Ethernet chip and a USB 2.0 chip to the Core Module are
provided.
5.1 Schematic Example for Connecting a Physical Ethernet Chip
Since the ADSP-BF537 Blackfin Chip from Analog Devices already has Ethernet functionality only a physical Ethernet
chip needs to be connected to the TCM-BF537 Core Module in order to make use of this feature.
ETxD[3..0]
ETxEN
MII_TxCLK
ERxD[3..0]
ERxDV
ERxCLK
ERxER
MII_CRS
COL
MDC
MDIO
nRESET_ETH1
nPD
MII_PHYINT
3V3
ETxD[3..0]
ETxEN
MII_TxCLK
ERxD[3..0]
ETxD3
ETxD2
ETxD1
ETxD0
ERxDV
ERxCLK
ERxER
ERxD3
ERxD2
ERxD1
ERxD0
MII_CRS
COL
MDC
MDIO
nRESET_ETH1
nPD
MII_PHYINT
R13
2k43
3V3
U2
20
19
18
17
16
15
14
TxD3
TxD2
TxD1
TxD0
Tx_EN
Tx_CLK/REFCLK
Tx_ER/TXD4
2.5V_VA
KS8721
VddRCV
VddRX
VddTX
38
31
42
600Z
C4
10u
L1
C5
10u
VddPLL 47 2.5V_PLL
L2
600Z
C6
Vdd_CORE 13 2.5V
10u
3
4
5
6
9
10
11
RxD3/PHYAD
Rx-
RxD2/PHYAD2
Rx+
RxD1/PHYAD3
FXSD/FXEN
RxD0/PHYAD4
Tx-
Rx_DV/CRSDV/PCS_LBPK Tx+
Rx_CLK
Rx_ER/ISO
REXT
32
33
34
40
41
37
22
21
2
1
CRS/RMII_BTB
COL/RMII
SPEED100/FEF
COLLISION/NWAYEN
MDC
ACTIVITY/TEST
MDIO
FDUPLEX
27
29
26
28
Rx‐
Rx+
Tx‐
Tx+
R7
6k49
GND
LED_SPEED
LED_ACT
48 RESET
30 PD
CLKIN/XTAL1 46
R11
27R
25 INT/PHYAD0
XTAL2 45
GND
2.5V_VA
R3
49R9
R4
49R9
2.5V_VA
GND
R9
49R9
R8
49R9
6 V1
5
4
3 V2
2
1
D‐TVS‐USB2.0 ‐> InvNr: 10549
1
xRx‐
2
3
GND
xRx+
4
xTx‐
5
6
2.5V_VA
xTx+
D‐TVS‐USB2.0 ‐> InvNr: 10549
R5
R6 27R
27R
2.5V_VA
R10
220R
R12
220R
3V3
CLKBUF
CLKBUF
GND
C8
100n
GND
C9
100n
Figure 5-1: Configuration with Physical Chip
2.5V_VA
R2
GND
10R
X3
RJ45 1:1 LED
12
3V3
11
8
7
3
Rd-
Rd+
3V3
2
1
9
10
Td-
Td+
C7
100n
GND
GND
Designator
Value
Part Number
Description
Quantity
C4, C5, C6
C7, C8, C9
L1, L2
R2
R3, R4, R8, R9
10u
100n
600Z
10R
49R9
C0805C106K9PAC
Capacitor non-polarized 3
2238 246 19876
Capacitor non-polarized 3
74279265
Ferrite
2
MC 0.063W 0603 1% 10R Resistor
1
MC 0.063W 0603 1% 49R9 Resistor
4
R5, R6, R11
27R
MC 0.063W 0603 1% 27R Resistor
3
R7
6k49
MC 0.063W 0603 1% 6K49 Resistor
1
R10, R12
220R
MC 0.063W 0603 1% 220R Resistor
2
R13
U2
V1, V2
X3
2k43
MULTICOMP
KSZ8721BLI-LQFP48L
USBLC6-2P6
RJLBC-060TC1
Resistor
1
10/100BASE Physical Layer 1
Transceiver
TSV-Diode for USB 2.0
2
RJ45-Connector with LEDs 1
Table 5-1: Bill of Material of Sample Schematic
TCM‐BF537 v1.x‐Hardware User Manual
32