H4005 Datasheet, PDF (6/6 Pages) List of Unclassifed Manufacturers – ISO 11 784 / 11 785 COMPLIANT READ ONLY CONTACTLESS IDENTIFICATION DEVICE

EM MICROELECTRONIC-MARIN SA
H4005
Package and Ordering Information
Dimensions of PCB version
H4005
8.0
4.0
Dimensions in [mm]
1.0
Fig. 7
CHIP Dimensions
1118
355
137
150
1016
COIL2
137
VSS
H4005
COIL1
150
VDD
118
160
200
1016 ₃₂₅
1380
118
137
COIL2
137
VSS
H4105 Bumped
200
COIL1
VDD
160
118
95
600
IC Thickness : 280 µm ± 25 µm
Bump Height : 25 µm ± 5 µm
118
Dimensions in µm
Fig. 8
Ordering Information
The H4005 is available
PCB
in chip form without Bumps
in chip form with Bumps
H4005 IC
H4105 Bumped IC
H4005 COB
EM MICROELECTRONIC-MARIN SA cannot assume responsibility for use of any circuitry described other than circuitry entirely embodied in an EM
MICROELECTRONIC-MARIN SA product.
EM MICROELECTRONIC-MARIN SA reserves the right to change the circuitry and specifications without notice at any time. You are strongly urged to ensure that
the information given has not been superseded by a more up to date version.
© 1997 EM Microelectronic-Marin SA, 11/97 Rev. C/190
EM MICROELECTRONIC-MARIN SA , 2074 Marin, Switzerland, Tel. [phone], Fax [phone]