HX6656 Datasheet, PDF (11/12 Pages) List of Unclassifed Manufacturers – 32K x 8 ROM-SOI

DYNAMIC BURN-IN DIAGRAM*
F16
R ¹ A14
F7
R ² A12
F6
R ³ A7
F5
R ⁴ A6
F4
R ⁵ A5
F3
R ⁶ A4
F2
R ⁷ A3
F8
R ⁸ A2
F13
R ⁹ A1
F14
R ¹⁰ A0
F1
R ¹¹ DQ0
F1
R ¹² DQ1
F1
R ¹³ DQ2
VSS
14 _VSS
VDD ²⁸
NC ²⁷
A13 ²⁶
A8 ²⁵
A9 ²⁴
A11 ²³
NOE ²²
A10 ²¹
NCS ²⁰
DQ7 ¹⁹
DQ6 ¹⁸
DQ5 ¹⁷
DQ4 ¹⁶
DQ3 ¹⁵
VDD
R
F0
R
F15
R
F12
R
F11
R
F10
R
F17
R
F9
R
F17
R
F1
R
F1
R
F1
R
F1
R
F1
HX6656
STATIC BURN-IN DIAGRAM*
VDD
R
R
R
R
R
R
R
R
R
R
R
R
R
VSS
1 _A14
2 _A12
3 _A7
4 _A6
5 _A5
6 _A4
7 _A3
8 _A2
9 _A1
10 _A0
11 _DQ0
12 _DQ1
13 _DQ2
14 _VSS
VDD ²⁸
NC ²⁷
A13 ²⁶
A8 ²⁵
A9 ²⁴
A11 ²³
NOE ²²
A10 ²¹
NCS ²⁰
DQ7 ¹⁹
DQ6 ¹⁸
DQ5 ¹⁷
DQ4 ¹⁶
DQ3 ¹⁵
VDD
R
R
R
R
R
R
R
R
R
R
R
R
R
R
VDD = 6.5V, R ≤ 10 KΩ, VIH = VDD, VIL = VSS
Ambient Temperature ≥ 125 °C, F0 ≥ 100 KHz Sq Wave
Frequency of F1 = F0/2, F2 = F0/4, F3 = F0/8, etc.
VDD = 5.5V, R ≤ 10 KΩ
Ambient Temperature ≥ 125 °C
*36-lead Flat Pack burn-in diagrams have similar connections and are available on request.
ROM CODE
The ROM code can be provided to Honeywell via FTP, E-Mail or a variety of magnetic storage media, including
3.5 inch floppy disc, 4m digital tape and others.
The ROM Code data file should contain the following format:
<address> [/] <data> [;] [Comment]
Where items enclosed in ‘[‘and’]’ are optional.
The address and data must be hex numbers in the form, MSB...LSB. The “/” and the “;” are optional and any
characters after the “#” are comments. For example the following input file, all of the lines are valid:
000 d4
001 / 32
002 1d
003 / 72;
4/5e; # all of these lines are in valid format
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