HX6656 Datasheet, PDF (10/12 Pages) List of Unclassifed Manufacturers – 32K x 8 ROM-SOI

HX6656
28-LEAD FLAT PACK (22017842-001)
E
1
TOP
VIEW
L
W
X
Y
Capacitor
Pads
b
(width)
e
(pitch)
S
U
Q GA
Kovar
Lid [4]
Ceramic
Body _C
Lead
Alloy 42 [3]
E2
E3
Index
BOTTOM
VIEW
All dimensions in inches
1
A 0.105 ± 0.015
b 0.017 ± 0.002
C 0.003 to 0.006
D 0.720 ± 0.008
e 0.050 ± 0.005 [1]
E 0.500 ± 0.007
E2 0.380 ± 0.008
E3 0.060 ref
F 0.650 ± 0.005 [2]
G 0.035 ± 0.004
L 0.295 min [3]
Q 0.026 to 0.045
S 0.045 ± 0.010
U 0.130 ref
W 0.050 ref
X 0.075 ref
Y 0.010 ref
[1] BSC – Basic lead spacing between centers
[2] Where lead is brazed to package
[3] Parts delivered with leads unformed
[4] Lid connected to VSS
28-LEAD DIP (22017785-001)
For 28-Lead DIP description, see MIL-STD-1835, Type CDIP2-T28, Config. C, Dimensions D-10
10