ISD5008 Datasheet, PDF (42/47 Pages) List of Unclassifed Manufacturers – SINGLE CHIP VOICE RECORD PLAYBACK DEVICE 4-, 5-, 6-, AND 8- MINUTE DURATIONS

ISD5008 Product
(1)
Figure 24: ISD5008 Series Bonding Physical Layout (Unpackaged Die)
MOSI
MISO
V_SSD
V
SSD
SS
SCLK
V_CCD
V
CCD
XCLK
INT
RAC
V_SSA
ISD5008 Series
I. Die Dimensions
X: 166.5 ±1 mils
Y: 302.4 ±1 mils
(3)
II. Die Thickness
11.5 ±1.0 mils
III. Pad Opening (min)
90 x 90 microns
3.5 x 3.5 mils
ISD5008
V_SSA
MIC+
MIC–
ANAOUT+
ANAOUT– _ACAP
AUXOUT
AUX IN
ANA IN
(2)
(2)
V_CCA
SP– V
SP+
SSA
1. The backside of die is internally connected to V _SS. It MUST NOT be connected to any other potential or damage
may occur.
2. Double bond recommended.
3. This figure reflects the current die thickness. Please contact ISD as this thickness may change in the future.
ISD
39