HWD2108 Datasheet, PDF (4/18 Pages) List of Unclassifed Manufacturers – Dual 105 mW Headphone Amplifier

Electrical Characteristics (Notes 2, 3) (Continued)
The following specifications apply for V_DD = 5V unless otherwise specified, limits apply to T_A = 25˚C.
Symbol
Parameter
Conditions
HWD2108
Typ (Note Limit (Note
7)
8)
C_L
Load Capacitance
SR
Slew Rate
Unity Gain Inverting
200
3
Units
(Limits)
pF
V/µs
Electrical Characteristics (Notes 2, 3)
The following specifications apply for V_DD = 3.3V unless otherwise specified, limits apply to T_A = 25˚C.
Symbol
Parameter
Conditions
Conditions
Typ (Note Limit (Note
7)
8)
I_DD
Supply Current
V_OS
Input Offset Voltage
P_o
Output Power
V_IN = 0V, I_O = 0A
1.0
V_IN = 0V
7
THD+N = 0.1%, f = 1 kHz
R_L = 16Ω
40
R_L = 32Ω
28
THD+N = 10%, f = 1 kHz
R_L = 16Ω
56
R_L = 32Ω
38
Units
(Limits)
mA (max)
mV (max)
mW
mW
mW
mW
Electrical Characteristics (Notes 2, 3)
The following specifications apply for V_DD = 2.6V unless otherwise specified, limits apply to T_A = 25˚C.
Symbol
Parameter
Conditions
Conditions
Typ (Note Limit (Note
7)
8)
I_DD
Supply Current
V_OS
Input Offset Voltage
P_o
Output Power
V_IN = 0V, I_O = 0A
0.9
V_IN = 0V
5
THD+N = 0.1%, f = 1 kHz
R_L = 16Ω
20
R_L = 32Ω
16
THD+N = 10%, f = 1 kHz
R_L = 16Ω
31
R_L = 32Ω
22
Units
(Limits)
mA (max)
mV (max)
mW
mW
mW
mW
Note 2: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 3: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T_JMAX, θ_JA, and the ambient temperature T_A. The maximum
allowable power dissipation is P _DMAX = (T_JMAX − T_A) / θ_JA. For the HWD2108, T_JMAX = 150˚C, and the typical junction-to-ambient thermal resistance, when board
mounted, is 210˚C/W for package MUA08A and 170˚C/W for package M08A.
Note 5: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 6: Machine Model, 220 pF–240 pF discharged through all pins.
Note 7: Typicals are measured at 25˚C and represent the parametric norm.
Note 8: Tested limits are guaranteed to CSMSC’s AOQL (Average Outgoing Quality Level). Datasheet min/max specification limits are guaranteed by design, test,
or statistical analysis.
Note 9: The given θ_JA is for an HWD2108 packaged in an LDA08B with the Exposed-DAP soldered to a printed circuit board copper pad with an area equivalent to
that of the Exposed-DAP itself.
Note 10: The given θ_JA is for an HWD2108 packaged in an LDA08B with the Exposed-DAP not soldered to any printed circuit board copper.
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