SI5321 Datasheet, PDF (30/34 Pages) List of Unclassifed Manufacturers – SONET/SDH PRECISION CLOCK MULTIPLIER IC

Si5321
5. Package Outline
Figure 12 illustrates the package details for the Si5321. Table 11 lists the values for the dimensions shown in the
illustration.
Figure 12. 63-Ball Ceramic Ball Grid Array (CBGA)
Dimension
A
A1
A2
A3
b
D
D1
e
S
Table 11. Package Drawing Dimensions
Description
Total Package Height
Standoff
Ceramic Thickness
Mold Cap Thickness
Solder Ball Diameter
Ceramic Body Size
Mold Cap Size
Solder Ball Pitch
Pitch to Centerline
Minimum
2.13
0.60
0.88
0.55
0.65
8.85
8.55
Nominal
2.28
0.70
0.98
0.60
0.70
9.00
8.75
1.00 BSC
0.50 BSC
Maximum
2.43
0.80
1.08
0.65
0.75
9.15
8.95
Rev. 2.3
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