PR01 Datasheet, PDF (12/13 Pages) Vishay Siliconix – Power Metal Film Resistors

Phoenix Passive Components
IEC
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PR01 5%
PR01 1%
4.7
-
4.8
-
Voltage proof on
insulation
Temperature
coefficient
500 V (RMS) during 1 minute,
V-block method.
Between
- 55 °C and + 155 °C
No breakdown
or flashover
≤ ±250 ppm/°C
4.16
4.16.2
4.16.3
4.16.4
21(U)
21(Ua1)
21(Ub)
21(Uc)
Robustness of
terminations:
Tensile all samples
Bending half number of
samples
Torsion other
half of samples
Load 10 N, 10s
Load 5 N, 4 X 90°
3 x 360° in opposite directions
No damage
∆R/R_max ±0.5% + 0.05 Ω
4.17
20(Ta)
4.18
20(Tb)
Solderability
(after ageing)
Resistance to
soldering heat
16 h 155 °C; immersed in flux
600, leads immersed 2 mm for
2 ±0.5 s in a solder bath at
235 ±5 °C
Thermal shock: 3 s; 350 ±10 °C;
6 mm from body
Good tinning
(≥ 95% covered)
No damage
∆R/R_max
∆R/R_max
±1% + 0.05 Ω ±0.5% + 0.05 Ω
4.19
4.22
4.23
4.23.2
4.23.3
4.23.4
4.23.6
14(Na)
6(Fc)
2(Ba)
30(Db)
1(Aa)
30(Db)
Rapid change of
temperature
Vibration
30 minutes at – 55 °C and
30 minutes at + 155 °C;
5 cycles
No visual damage
∆R/R_max
∆R/R_max
±1% + 0.05 Ω ±0.5% + 0.05 Ω
Frequency 10 to 500 Hz,
displacement 1.5mm or
acceleration 10g; three
directions; total 6 hours (3 x 2 h)
No damage
∆R/R_max ±0.5% + 0.05 Ω
Climatic sequence:
Dry heat
Damp heat (accelerated)
1^st cycle
Cold
Damp heat (accelerated)
remaining cycles
16 h; 155 °C
24 h; 25 °C to 55 °C;
90 to 100% RH
2 h; - 55 °C
5 days; 25 °C to 55 °C;
90to 100% R.H.
R_{ins min} 10³ MΩ
∆R/R_max
±3% + 0.05 Ω
∆R/R_max
±1% + 0.05 Ω
PR01
 PHOENIX DO BRASIL LTDA
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Revision on 2003/12/21
Page 12 of 13