EPC700 Datasheet, PDF (10/11 Pages) Espros Photonics corp – 24V/50mA General-Purpose Output-Driver

epc700/epc702
Reflow Solder Profile
For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for
Pb-free assembly for both types of packages. The peak soldering t emperature (TL) should not exceed +260°C for a maximum of 4 sec.
Packaging Information (all measures in mm)
Tape & Reel Information
The devices are packaged into embossed tapes for automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13
inch) reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and indic-
ate the tape sizes for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association (EIA)
standard 481-1, 481-2, 481-3.
CSP6 Tape
Pin 1
QFN16 Tape
Pin 1
2
8
epc does not guarantee th^Ca^St^Pt⁶he^Tare^peare no empty cavitiPeisn 1in the tape. Thus^Q, ^Fth^Ne¹⁶p^Tic^ak^p-^eand-place machinePsihno1uld check the presence of a chip
during picking.
Ordering Information
Part Number
epc700-CSP6
epc700-QFN16
epc701-CSP6
epc701-QFN16
epc702-CSP6
epc702-QFN16
epc703-CSP6
epc703-QFN16
Package
4^CSP6
QFN16
CSP6
QFN16
CSP6
QFN16
CSP6
QFN16
RoHS compliance
Yes
Yes
Yes
8
Yes
Yes
Yes
Yes
Yes
Packaging Method
Reel
Reel
Reel
Reel
Reel
Reel
Reel
Reel
© 2011 ESPROS Photonics Corporation
10
Characteristics subject to change without notice
Datasheet epc700_702 - V2.2
www.espros.ch