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EN29GL128H Datasheet, PDF (48/54 Pages) Eon Silicon Solution Inc. – 128 Megabit (16384K x 8-bit / 8192K x 16-bit) Flash Memory Page mode Flash Memory, CMOS 3.0 Volt-only
TABLE 22. ERASE AND PROGRAMMING PERFORMANCE
EN29GL128H/L
Parameter
Sector Erase Time
Chip Erase Time
Byte Programming Time
Word Programming Time
Chip Programming
Time
Byte
Word
Total Write Buffer time
ACC Total Write Buffer time
Erase/Program Endurance
Typ
0.1
30
8
8
134.4
67.2
160
60
100K
Limits
Max
2
120
200
200
403.2
201.6
Comments
Unit
sec
Excludes 00h programming prior
to erasure
sec
µs
µs
sec
Excludes system level overhead
µs
cycles
Minimum 100K cycles
Notes:
1. Typical program and erase times assume the following conditions: room temperature, 3V and checkboard
pattern programmed.
2. Maximum program and erase times assume the following conditions: worst case Vcc, 90°C and 100,000 cycles.
Table 23. 56-PIN TSOP PIN CAPACITANCE @ 25°C, 1.0MHz
Parameter Symbol
Parameter Description
Test Setup
Typ
Max
CIN
Input Capacitance
VIN = 0
6
7.5
COUT
Output Capacitance
VOUT = 0
8.5
12
CIN2
Control Pin Capacitance
VIN = 0
Note: Test conditions are Temperature = 25°C and f = 1.0 MHz.
7.5
9
Unit
pF
pF
pF
Table 24. DATA RETENTION
Parameter Description
Data Retention Time
Test Conditions
Min
150°C
10
125°C
20
Unit
Years
Years
This Data Sheet may be revised by subsequent versions
48
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/01
www.eonssi.com