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EN25B05 Datasheet, PDF (23/30 Pages) Eon Silicon Solution Inc. – 512 Kbit Serial Flash Memory with Boot and Parameter Sectors
EN25B05
Table 11. 50MHz AC Characteristics
(Ta = 0°C to 70°C or - 40°C to 85°C; VCC = 2.7-3.6V)
Symbol
FR
Alt
fC
Parameter
Serial Clock Frequency for:
FAST_READ, PP, SE, BE, DP, RES, WREN,
WRDI, RDSR, WRSR
Min
D.C.
Typ
Max
50
fR
Serial Clock Frequency READ instruction
D.C.
33
tCLH 1
Serial Clock High Time
9
tCLL1
Serial Clock Low Time
9
tCLCH2
Serial Clock Rise Time (Slew Rate)
0.1
tCHCL 2
Serial Clock Fall Time (Slew Rate)
0.1
tSLCH
tCSS CS# Active Setup Time
5
tCHSH
CS# Active Hold Time
5
tSHCH
CS# Not Active Setup Time
5
tCHSL
CS# Not Active Hold Time
5
tSHSL
tCSH CS# High Time
100
tSHQZ 2
tDIS Output Disable Time
9
tCLQX
tHO Output Hold Time
0
tDVCH
tDSU Data In Setup Time
5
tCHDX
tDH Data In Hold Time
5
tHLCH
HOLD# Low Setup Time ( relative to SCK )
5
tHHCH
HOLD# High Setup Time ( relative to SCK )
5
tCHHH
HOLD# Low Hold Time ( relative to SCK )
5
tCHHL
HOLD# High Hold Time ( relative to SCK )
5
tHLQZ 2
tHZ HOLD# Low to High-Z Output
9
tHHQZ 2
tLZ HOLD# High to Low-Z Output
9
tCLQV
tV
Output Valid from SCK
9
tWHSL3
Write Protect Setup Time before CS# Low
20
tSHWL3
Write Protect Hold Time after CS# High
100
tDP 2
CS# High to Deep Power-down Mode
3
tRES1 2
tRES2 2
tW
CS# High to Standby Mode without Electronic
Signature read
CS# High to Standby Mode with Electronic
Signature read
Write Status Register Cycle Time
3
1.8
10
15
tPP
Page Programming Time
1.5
5
Sector Erase Time 32KB sectors
tSE
Sector Erase Time 16KB sectors
Sector Erase Time 4KB sectors
0.5
1
0.5
1
0.3
0.6
tBE
Bulk Erase Time
1.5
3
Note: 1. TSCKH + TSCKL must be greater than or equal to 1/ FCLK
2. Value guaranteed by characterization, not 100% tested in production.
3. Only applicable as a constraint for a Write status Register instruction when Status Register Protect Bit is set at 1.
Unit
MHz
MHz
ns
ns
V / ns
V / ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
µs
µs
ms
ms
s
s
This Data Sheet may be revised by subsequent versions 23 ©2004 Eon Silicon Solution, Inc., www.essi.com.tw
or modifications due to changes in technical specifications.
Rev. B, Issue Date: 2006/12/26