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EN25QH64 Datasheet, PDF (14/65 Pages) Eon Silicon Solution Inc. – 64 Megabit Serial Flash Memory with 4Kbyte Uniform Sector
Table 3. Protected Area Sizes Sector Organization
EN25QH64
Status Register Content
Memory Content
BP3 BP2 BP1 BP0
Bit Bit Bit Bit
Protect Areas
Addresses
Density(KB) Portion
00
0
0
None
None
None
None
00
0
1
Block 127
7F0000h-7FFFFFh 64KB
Upper 1/128
00
1
0
Block 126 to 127 7E0000h-7FFFFFh 128KB
Upper 2/128
00
1
1
Block 124 to 127 7C0000h-7FFFFFh 256KB
Upper 4/128
01
0
0
Block 120 to 127 780000h-7FFFFFh 512KB
Upper 8/128
01
0
1
Block 112 to 127 700000h-7FFFFFh 1024KB
Upper 16/128
01
1
0
Block 96 to 127 600000h-7FFFFFh 2048KB
Upper 32/128
01
1
1
All
000000h-7FFFFFh 8192KB
All
10
0
0
None
None
None
None
10
0
1
Block 0
000000h-00FFFFh 64KB
Lower 1/128
10
1
0
Block 0 to 1
000000h-01FFFFh 128KB
Lower 2/128
10
1
1
Block 0 to 3
000000h-03FFFFh 256KB
Lower 4/128
11
0
0
Block 0 to 7
000000h-07FFFFh 512KB
Lower 8/128
11
0
1
Block 0 to 15
000000h-0FFFFFh 1024KB
Lower 16/128
11
1
0
Block 0 to 31
000000h-1FFFFFh 2048KB
Lower 32/128
11
1
1
All
000000h-7FFFFFh 8192KB
All
INSTRUCTIONS
All instructions, addresses and data are shifted in and out of the device, most significant bit first. Serial
Data Input (DI) is sampled on the first rising edge of Serial Clock (CLK) after Chip Select (CS#) is
driven Low. Then, the one-byte instruction code must be shifted in to the device, most significant bit first,
on Serial Data Input (DI), each bit being latched on the rising edges of Serial Clock (CLK).
The instruction set is listed in Table 4. Every instruction sequence starts with a one-byte instruction
code. Depending on the instruction, this might be followed by address bytes, or by data bytes, or by
both or none. Chip Select (CS#) must be driven High after the last bit of the instruction sequence has
been shifted in. In the case of a Read Data Bytes (READ), Read Data Bytes at Higher Speed
(Fast_Read), Dual Output Fast Read (3Bh), Dual I/O Fast Read (BBh), Quad Input/Output
FAST_READ (EBh), Read Status Register (RDSR), Read Information Register (RDIFR) or Release
from Deep Power-down, and Read Device ID (RDI) instruction, the shifted-in instruction sequence is
followed by a data-out sequence. Chip Select (CS#) can be driven High after any bit of the data-out
sequence is being shifted out.
In the case of a Page Program (PP), Sector Erase (SE), Block Erase (BE), Chip Erase (CE), Write
Status Register (WRSR), Write Enable (WREN), Write Disable (WRDI) or Deep Power-down (DP)
instruction, Chip Select (CS#) must be driven High exactly at a byte boundary, otherwise the instruction
is rejected, and is not executed. That is, Chip Select (CS#) must driven High when the number of clock
pulses after Chip Select (CS#) being driven Low is an exact multiple of eight. For Page Program, if at
any time the input byte is not a full byte, nothing will happen and WEL will not be reset.
In the case of multi-byte commands of Page Program (PP), and Release from Deep Power Down
(RES ) minimum number of bytes specified has to be given, without which, the command will be
ignored.
In the case of Page Program, if the number of byte after the command is less than 4 (at least 1
data byte), it will be ignored too. In the case of SE and BE, exact 24-bit address is a must, any
less or more will cause the command to be ignored.
All attempts to access the memory array during a Write Status Register cycle, Program cycle or Erase
cycle are ignored, and the internal Write Status Register cycle, Program cycle or Erase cycle continues
unaffected.
This Data Sheet may be revised by subsequent versions
14
or modifications due to changes in technical specifications.
©2013 Eon Silicon Solution, Inc.,
Rev. J, Issue Date: 2013/12/27
www.eonssi.com