EMP216MFAW Datasheet, PDF (3/11 Pages) Emerging Memory & Logic Solutions Inc – 2Mx16 Pseudo Static RAM

2Mb x16 Pseudo Static RAM
GENERAL WAFER SPECIFICATIONS
- Process Technology : 0.125um CMOS Deep trench process
- 3 Metal layers including local inter-connection
- Wafer thickness : 725 +/- 25um
- Wafer Diameter : 8-inch
PAD DESCRIPTION
Name
Function
Name
Function
CS#
OE#
WE#
Chip select inputs LB#
Output enable input UB#
Write enable input VCC
Lower byte (DQ_0~7)
Upper byte (DQ_8~15)
Power supply
ZZ# Low Power Control VCCQ I/O Power supply
DQ_0-15 Data In-out
A_0-20 Address inputs
VSS(Q) Ground
NC
No connection
Preliminary
EMP216MFAW Series
2Mx16 Pseudo Static RAM
¢
Rev 0.0