English
Language : 

DFM600BXS17-A000 Datasheet, PDF (2/7 Pages) Dynex Semiconductor – Fast Recovery Diode Module
SEMICONDUCTOR
DFM600BXS17-A000
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. In
extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package.
Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect
device reliability.
Tcase = 25°C unless stated otherwise
Symbol
Parameter
VRRM
IF
IFM
Repetitive peak reverse voltage
Forward current
Max. forward current
IFSM
I2t
Pmax
Visol
Surge (non-repetitive) forward
current
I2t value fuse current rating
Maximum power dissipation
Isolation voltage – per module
Test Conditions
Tvj = 125°C
DC, Tcase = 65°C, Tvj = 125°C
Tcase =110 °C, tp = 1ms
VR = 0, tP = 10ms, Tvj = 125°C
Tcase = 25°C, Tvj = 125°C
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
Max. Units
1700
V
600
A
1200
A
3674
A
67.5
2000
4000
kA2s
W
V
THERMAL AND MECHANICAL RATINGS
Internal insulation material:
Baseplate material:
Creepage distance:
Clearance:
CTI (Critical Tracking Index):
Al2O3
Copper
20mm
11mm
425
Symbol
Rth(j-c)
Rth(c-h)
Tj
Tstg
-
Parameter
Test Conditions
Min. Typ. Max.
Units
Thermal resistance
Continuous dissipation –
-
-
50
°C/kW
junction to case
Thermal resistance – case to heatsink Mounting torque 5Nm
(with mounting grease)
-
-
15
°C/kW
Junction temperature
-
-
-
125
°C
Storage temperature range
-
-40
-
125
°C
Screw torque
Mounting – M6
3
-
5
Nm
Electrical connections – M6 2.5
-
5
Nm
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
2/7
www.dynexsemi.com