74AUP2G34 Datasheet, PDF (3/12 Pages) NXP Semiconductors – Low-power dual buffer

74AUP2G34
Absolute Maximum Ratings (Notes 6,7) (@T_A = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD CDM
ESD MM
V_CC
V_I
V_O
I_IK
I_OK
I_O
I_CC
I_GND
T_J
T_STG
Parameter
Human Body Model ESD Protection
Charged Device Model ESD Protection
Machine Model ESD Protection
Supply Voltage Range
Input Voltage Range
Voltage Applied to Output in High or Low State
Input Clamp Current V_I < 0
Output Clamp Current (V_O < 0 )
Continuous Output Current (V_O = 0 to V_CC)
Continuous Current Through V_CC
Continuous Current Through GND
Operating Junction Temperature
Storage Temperature
Rating
Unit
2
kV
1
kV
200
V
-0.5 to +4.6
V
-0.5 to +4.6
V
-0.5 to V_CC +0.5
V
50
mA
-50
mA
±20
mA
50
mA
-50
mA
-40 to +150
°C
-65 to +150
°C
Notes:
6. Stresses beyond the absolute maximum may result in immediate failure or reduced reliability. These are stress values and device
operation should be within recommend values.
7. Forcing the maximum allowed voltage could cause a condition exceeding the maximum current or conversely forcing the maximum current could
cause a condition exceeding the maximum voltage. The ratings of both current and voltage must be maintained within the controlled range..
Recommended Operating Conditions (Note 8) (@T_A = +25°C, unless otherwise specified.)
Symbol
Parameter
Min
V_CC
Operating Voltage
—
0.8
V_I
Input Voltage
0
V_O
Output Voltage
0
V_CC = 0.8V
—
V_CC = 1.1V
—
I_OH
High-Level Output Current
V_CC = 1.4V
V_CC = 1.65V
—
—
V_CC = 2.3V
—
V_CC = 3.0V
—
V_CC = 0.8V
—
V_CC = 1.1V
—
I_OL
Low-Level Output Current
V_CC = 1.4V
V_CC = 1.65V
—
—
V_CC = 2.3V
—
V_CC = 3.0V
—
∆t/∆V Input Transition Rise or Fall Rate V_CC = 0.8V to 3.6V
—
T_A
Operating Free-Air Temperature —
-40
Note:
8. Unused inputs should be held at V_CC or Ground.
Max
3.6
3.6
V_CC
-20
-1.1
-1.7
-1.9
-3.1
-4
20
1.1
1.7
1.9
3.1
4
200
+125
Unit
V
V
V
µA
mA
µA
mA
ns/V
°C
74AUP2G34
Document number: DS35514 Rev. 5 - 2
3 of 12
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May 2014
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