DS5002FP_06 Datasheet, PDF (25/25 Pages) Dallas Semiconductor – Secure Microprocessor Chip

DS5002FP Secure Microprocessor Chip
REVISION HISTORY
REVISION
112795
073096
111996
061297
051499
052599
062102
100102
030403
070605
090805
DESCRIPTION
Original release.
Change V_CC02 specification from V_LI - 0.5 to V_LI - 0.65 (PCN F62501).
Update mechanical specifications.
Change V_CC01 from V_CC - 0.3 to V_CC - 0.35.
PF signal moved from V_OL2 test specification to V_OL1. PCN No. (D72502).
AC characteristics for battery-backed SDI pulse specification added.
Reduced absolute maximum voltage to V_CC + 0.5V.
Added note clarifying storage temperature specification is for nonbattery-backed state.
Deleted I_BAT specification (Duplicate of I_LI specification).
Changed RRE min (industrial temp range) from 40kΩ to 30kΩ.
Changed V_PFW max (industrial temp range) from 4.5V to 4.6V.
Added industrial specification for I_LI.
Reduced t_CE1HOV and t_CEHDV from 10ns to 0ns.
Minor revisions and approval.
Update V_CCO and I_CCO1 specifications to reflect 0.45V internal voltage drop instead of 0.35V.
Ordering information updated.
Reset Trip Point in Stop Mode (DC Characteristics) with BAT = 3.0V was changed to 3.3V (original issue
was 3.3V).
Added Pb-free part numbers to Ordering Information and Selector Guide.
Added Operating Voltage specification. (This is not a new specification because operating voltage is implied
in the testing limits, but rather a clarification.)
Updated Absolute Maximum soldering temperature to reference JEDEC standard.
In the AC Characteristics—SDI Pin table, changed t_SPR MAX (in active mode) from 2µs to 1.3µs. This
change is only to correct a documentation error, and does not reflect a change in device operation or any
change in testing.
072806
Removed products from Ordering Information table that do not contain internal micro probe shields.
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