DS1339 Datasheet, PDF (18/18 Pages) Dallas Semiconductor – Serial Real-Time Clock

DS1339 I²C Serial Real-Time Clock
HANDLING, PC BOARD LAYOUT, AND ASSEMBLY
The DS1339C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided
to prevent damage to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
The SO package may be reflowed as long as the peak temperature does not exceed 240°C. Peak reflow
temperature (≥ 230°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed
40 seconds (30 seconds nominal). Exposure to reflow is limited to 2 times maximum.
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020B standard for
moisture-sensitive device (MSD) classifications.
PIN CONFIGURATIONS
TOP VIEW
X1
X2
VBACKUP
GND
DS1339
VCC
SQW/INT
SCL
SDA
mSOP
TOP VIEW
SCL
SQW/INT
V_CC
N.C.
N.C.
N.C.
N.C.
N.C.
DS1339C
SDA
GND
V _BACKUP
N.C.
N.C.
N.C.
N.C.
N.C.
SO (300 mils)
CHIP INFORMATION
TRANSISTOR COUNT: 11,325
PROCESS: CMOS
THERMAL INFORMATION
PART
µSOP
SO
THETA-J_A
(°C/W)
229
73
THETA-J_C
(°C/W)
39
23
CONDITIONS
Typical
PACKAGE INFORMATION
For the latest package outline information, go to www.maxim-ic.com/DallasPackInfo.
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are registered trademarks of Maxim Integrated Products, Inc., and Dallas Semiconductor Corporation.