DS1553 Datasheet, PDF (17/19 Pages) Maxim Integrated Products – 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM

DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM
PACKAGE INFORMATION (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package
outline information, go to www.maxim-ic.com/DallasPackInfo.)
PKG
DIM
A
B
C
D
E
F
G
MIN
0.920
0.980
—
0.052
0.048
0.015
0.025
DS1553P
INCHES
NOM
0.925
0.985
—
0.055
0.050
0.020
0.027
MAX
0.930
0.990
0.080
0.058
0.052
0.025
0.030
NOTE: Dallas Semiconductor recommends that PowerCap
Module bases experience one pass through solder reflow
oriented with the label side up (“live-bug”).
Hand Soldering and Touch-Up: Do not touch or apply the
soldering iron to leads for more than 3 seconds. To solder,
apply flux to the pad, heat the lead frame pad and apply solder.
To remove the part, apply flux, heat the lead frame pad until the
solder reflows and use a solder wick to remove solder.
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