DS1644P Datasheet, PDF (12/13 Pages) Dallas Semiconductor – Nonvolatile Timekeeping RAM

DS1644/DS1644P
PACKAGE INFORMATION
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information, go to www.maxim-ic.com/DallasPackInfo.)
DS1644 28-PIN PACKAGE
PKG
DIM
A IN.
MM
B IN.
MM
C IN.
MM
D IN.
MM
E IN.
MM
F IN.
MM
G IN.
MM
H IN.
MM
J IN.
MM
K IN.
MM
28-PIN
MIN
1.470
37.34
0.715
18.16
0.335
8.51
0.075
1.91
0.015
0.38
0.140
3.56
0.090
2.29
0.590
14.99
0.010
0.25
0.015
0.38
MAX
1.490
37.85
0.740
18.80
0.365
9.27
0.105
2.67
0.030
0.76
0.180
4.57
0.110
2.79
0.630
16.00
0.018
0.45
0.025
0.64
DS1644P
PKG
DIM
A
B
C
D
E
F
G
INCHES
MIN
0.920
0.980
-
0.052
0.048
0.015
0.025
NOM
0.925
0.985
-
0.055
0.050
0.020
0.027
MAX
0.930
0.990
0.080
0.058
0.052
0.025
0.030
NOTE FOR THE PowerCap VERSION:
a. DALLAS SEMICONDUCTOR RECOMMENDS THAT PowerCap
MODULE BASES EXPERIENCE ONE PASS THROUGH
SOLDER REFLOW ORIENTED WITH THE LABEL SIDE UP
(“LIVE - BUG”).
b. HAND SOLDERING AND TOUCH-UP: DO NOT TOUCH OR
APPLY THE SOLDERING IRON TO LEADS FOR MORE THAN
3 SECONDS. TO SOLDER, APPLY FLUX TO THE PAD, HEAT
THE LEAD FRAME PAD AND APPLY SOLDER. TO REMOVE
THE PART, APPLY FLUX, HEAT THE LEAD FRAME PAD
UNTIL THE SOLDER REFLOWS AND USE A SOLDER WICK
TO REMOVE SOLDER.
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