DS1330W Datasheet, PDF (10/11 Pages) Dallas Semiconductor – 3.3V 256K Nonvolatile SRAM with Battery Monitor

DS1330W
DS1330W NONVOLATILE SRAM, 34–PIN POWERCAP MODULE WITH POWERCAP
TOP VIEW
SIDE VIEW
PKG
DIM
A
B
C
D
E
F
G
MIN
0.920
0.955
0.240
0.052
0.048
0.015
0.020
INCHES
NOM
0.925
0.960
0.245
0.055
0.050
0.020
0.025
MAX
0.930
0.965
0.250
0.058
0.052
0.025
0.030
ASSEMBLY AND USE
Reflow soldering
Dallas Semiconductor recommends that
PowerCap Module bases experience
one pass through solder reflow oriented
label–side up (live–bug).
Hand soldering and touch–up
Do not touch soldering iron to leads for
more than 3 seconds. To solder, apply
flux to the pad, heat the lead frame pad
and apply solder. To remove part, apply
flux, heat pad until solder reflows, and
use a solder wick.
LPM replacement in a socket
To replace a Low Profile Module in a
68–pin PLCC socket, attach a
DS9034PC PowerCap to a module base
then insert the complete module into the
socket one row of leads at a time, push-
ing only on the corners of the cap. Never
apply force to the center of the device.
To remove from a socket, use a PLCC
extraction tool and ensure that it does
not hit or damage any of the module IC
components. Do not use any other tool
for extraction.
BOTTOM VIEW: REFERENCE ONLY
COMPONENTS AND PLACEMENTS
MAY DIFFER FROM THOSE SHOWN
022598 10/11