BTD1858A3 Datasheet, PDF (8/9 Pages) Cystech Electonics Corp. – Silicon NPN Epitaxial Planar Transistor

CYStech Electronics Corp.
TO-92 Taping Outline
Spec. No. : C856A3
Issued Date : 2006.06.05
Revised Date : 2006.06.08
Page No. : 8/9
DIM
A
D
D1
D2
E
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
L1
P
P1
P2
T
T1
T2
W
W1
-
Item
Component body height
Tape Feed Diameter
Lead Diameter
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
Adhesive Tape Width
20 pcs Pitch
BTD1858A3
Millimeters
Min.
Max.
4.33
4.83
3.80
4.20
0.36
0.53
4.33
4.83
1.5
2.0
2.40
2.90
-
±0.3
15.50
16.50
8.50
9.50
-
1
-
1
-
27
-
21
-
11
2.50
-
12.50
12.90
5.95
6.75
50.30
51.30
-
0.55
-
1.42
0.36
0.68
17.50
19.00
5.00
7.00
253
255
CYStek Product Specification