BTN3501F3 Datasheet, PDF (6/6 Pages) Cystech Electonics Corp. – Low Vcesat NPN Epitaxial Planar Transistor

CYStech Electronics Corp.
TO-263 Dimension
Spec. No. : C606F3
Issued Date : 2005.11.24
Revised Date : 2005.11.30
Page No. : 6/6
Marking :
A
C
E
α1
F
2
N3501
B
D
123
I
J
K
L
α2
Style : Pin 1.Base 2.Collector 3.Emitter
G
H
α3
3-Lead Plastic Surface Mounted Package
CYStek Package Code : F3
DIM
Inches
Min.
Max.
A 0.3800 0.4050
Millimeters
Min.
Max.
9.65
10.29
DIM
Inches
Min.
Max.
I
0.0500 0.0700
*:Typical
Millimeters
Min.
Max.
1.27
1.78
B 0.3300 0.3700 8.38
9.40
J
-
*0.1000
-
*2.54
C
-
0.0550
-
1.40
K 0.0450 0.0550 1.14
1.40
D 0.5750 0.6250 14.61 15.88
L 0.0200 0.0390 0.51
0.99
E 0.1600 0.1900 4.06
4.83
α1
-
-
6°
8°
F 0.0450 0.0550 1.14
1.40
α2
-
-
6°
8°
G 0.0900 0.1100 2.29
2.79
α3
-
H 0.0180 0.0290 0.46
0.74
-
0°
5°
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTN3501F3
CYStek Product Specification