BTD7521H8 Datasheet, PDF (6/6 Pages) Cystech Electonics Corp. – High Voltage NPN Epitaxial Planar Transistor

CYStech Electronics Corp.
Power pak (DFN5×6) Dimension
Spec. No. : C615H8
Issued Date : 2010.07.06
Revised Date :
Page No. : 6/6
Marking:
Device Name
Date Code
8-Lead power pak Plastic Package
CYStek Package Code: H8
DIM
Inches
Min.
Max.
Millimeters
Min.
Max.
A 0.0315 0.0394 0.80
1.00
A1 0.0000 0.0020 0.00
0.05
b 0.0138 0.0194 0.35
0.49
c 0.0089 0.0112 0.224 0.284
D 0.1937 0.2016 4.90
5.10
DIM
Inches
Min.
Max.
E 0.2253 0.2332
e
H 0.2352 0.2431
L1 0.0040 0.0198
*: Typical
Millimeters
Min.
Max.
5.70
5.90
1.27 BSC
5.95
6.15
0.10
0.50
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: pure tin plated
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD7521H8
CYStek Product Specification