English
Language : 

CY14E256L Datasheet, PDF (8/16 Pages) Cypress Semiconductor – 256-Kbit (32K x 8) nvSRAM
PRELIMINARY
AC Switching Characteristics
Parameter
Cypress
Alt.
Parameter Parameter
Description
SRAM Read Cycle
tACE
tRC [4]
tAA [5]
tACS
tRC
tAA
tDOE
tOHA [5]
tLZCE [6]
tHZCE [6]
tLZOE [6]
tHZOE [6]
tPU[ 3]
tPD [3]
tOE
tOH
tLZ
tHZ
tOLZ
tOHZ
tPA
tPS
SRAM Write Cycle
Chip Enable Access Time
Read Cycle Time
Address Access Time
Output Enable to Data Valid
Output Hold After Address Change
Chip Enable to Output Active
Chip Disable to Output Inactive
Output Enable to Output Active
Output Disable to Output Inactive
Chip Enable to Power Active
Chip Disable to Power Standby
tWC
tWC
tPWE
tWP
tSCE
tCW
tSD
tDW
tHD
tDH
tAW
tAW
tSA
tAS
tHA
tWR
tHZWE [6,7] tWZ
tLZWE [6]
tOW
Write Cycle Time
Write Pulse Width
Chip Enable To End of Write
Data Set-Up to End of Write
Data Hold After End of Write
Address Set-Up to End of Write
Address Set-Up to Start of Write
Address Hold After End of Write
Write Enable to Output Disable
Output Active after End of Write
AutoStore/Power-Up RECALL
Parameter
Description
tHRECALL [8]
tSTORE [9]
Power-Up RECALL Duration
STORE Cycle Duration
VSWITCH
Low Voltage Trigger Level
tVCCRISE
VCC Rise Time
Notes:
4. WE must be HIGH during SRAM Read Cycles.
5. Device is continuously selected with CE and OE both Low.
6. Measured ±200mV from steady state output voltage.
7. If WE is Low when CE goes Low, the outputs remain in the high-impedance state.
8. tHRECALL starts from the time VCC rises above VSWITCH.
9. If an SRAM Write has not taken place since the last non-volatile cycle, no STORE will take place.
CY14E256L
25ns part
Min. Max.
45ns part
Min. Max. Unit
25
45 ns
25
45
ns
25
45 ns
10
20 ns
5
5
ns
5
5
ns
10
15 ns
0
0
ns
10
15 ns
0
0
ns
25
45 ns
25
45
ns
20
30
ns
20
30
ns
10
15
ns
0
0
ns
20
30
ns
0
0
ns
0
0
ns
10
14 ns
5
5
ns
CY14E256L
Min.
Max.
Unit
550
µs
10
ms
4.0
4.5
V
150
µs
Document #: 001-06968 Rev. *C
Page 8 of 16
[+] Feedback