CYRF69103_10 Datasheet, PDF (66/68 Pages) Cypress Semiconductor – Programmable Radio on Chip Low Power

CYRF69103
27. Ordering Information
Package
40-Pin Pb-Free QFN 6x6 mm
Ordering Part Number
CYRF69103-40LFXC
28. Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this
moisture.The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure
time may degrade device reliability.
Table 28-1. Package Handling
Parameter
T_BAKETEMP
T_BAKETIME
Description
Bake Temperature
Bake Time
Min
see package label
Typ
Max
Unit
125 see package label °C
72
hours
29. Package Diagram
Figure 29-1. 40-Pin Pb-Free QFN 6x6 mm
Document #: 001-07611 Rev *F
001-12917 *B
Page 66 of 68
[+] Feedback