CY7C601XX_09_09 Datasheet, PDF (64/68 Pages) Cypress Semiconductor – enCoRe II Low Voltage Microcontroller

CY7C601xx, CY7C602xx
23. Package Diagrams
12
Figure 23-1. 24-Pin (300-Mil) SOIC S13
PIN 1 ID
1
NOTE :
1. JEDEC STD REF MO-119
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
3. DIMENSIONS IN INCHES
0.291[7.391]
0.300[7.620]
4. PACKAGE WEIGHT 0.65gms
*
0.394[10.007]
0.419[10.642]
MIN.
MAX.
13
24
0.026[0.660]
0.032[0.812]
PART #
S24.3 STANDARD PKG.
SZ24.3 LEAD FREE PKG.
0.597[15.163]
0.615[15.621]
SEATING PLANE
0.050[1.270]
TYP.
0.013[0.330]
0.019[0.482]
0.092[2.336]
0.105[2.667]
*
0.004[0.101]
0.0118[0.299]
0.004[0.101]
0.015[0.381]
0.050[1.270]
*
0.0091[0.231]
0.0125[0.317]
51-85025 *C
Figure 23-2. 24-Pin (300-Mil) PDIP P13
Document 38-16016 Rev. *F
51-85013-*B
Page 64 of 68
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