BCM20713A1KUBXGT Datasheet, PDF (64/65 Pages) Cypress Semiconductor – Single-Chip Bluetooth Transceiver and Baseband Processor

BCM20713 Preliminary Data Sheet
Ordering Information
Section 10: Ordering Information
Table 29 lists available part numbers and describes differences in package type, available I/O, and functional
configuration. See the referenced figures and tables for mechanical drawings and package I/O information.
All packages are rated from –40°C to +85°C.
Table 29: Part Ordering Information
Part Number
Package Type
Functional I/O Features
Strapped
Configuration
BCM20713A1KUFBXG
BCM20713A1KUBG
50-ball FPBGA,
4.5 mm x 4.0 mm x 0.6 mm.
See Figure 20 on page 60.
Dedicated Coex^a, more GPIO,
TM0^b
Table 8 on page 38
42-bump WLBGA,
Table 9 on page 39
3.02 mm x 2.51 mm x 0.55 mm.
See Figure 21 on page 61.
TCXO AND/OR
mode enabled
TCXO AND/OR
mode enabled
a. All packages support coexistence features through the ability to re-purpose most digital I/O based on the
desired user configuration. Package include balls coexistence functionality (default).
b. TM0 allows configuration of CLK_REQ output polarity.
Broadcom^®
December 21, 2015 • 20713-DS102-R
Single-Chip Bluetooth Transceiver and Baseband Processor
Page 63
BROADCOM CONFIDENTIAL