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CY7C1440AV25 Datasheet, PDF (6/32 Pages) Cypress Semiconductor – 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM
CY7C1440AV25
CY7C1442AV25
CY7C1446AV25
Pin Configurations (continued)
209-ball FBGA (14 x 22 x 1.76 mm) Pinout
CY7C1442AV25 (512K x 72)
1
2
3
4
5
6
7
8
9
10
11
A
DQG DQG
A
CE2 ADSP ADSC
ADV CE3
A
DQB DQB
B
DQG DQG BWSC BWSG NC/288M BW
A
BWSB BWSF DQB DQB
C
DQG DQG BWSH BWSD NC/144M CE1 NC/576M BWSE BWSA DQB DQB
D
DQG DQG VSS
NC NC/1G OE
GW NC
VSS
DQB DQB
E
DQPG DQPC VDDQ VDDQ VDD
VDD
VDD
VDDQ VDDQ DQPF DQPB
F
DQC DQC VSS
VSS
VSS NC
VSS VSS
VSS
DQF DQF
G
DQC DQC VDDQ VDDQ VDD NC
VDD
VDDQ VDDQ DQF
DQF
H
DQC DQC VSS
VSS
VSS NC
VSS VSS
VSS
DQF DQF
J
DQC DQC VDDQ VDDQ VDD NC
VDD
VDDQ VDDQ DQF
DQF
K
NC
NC CLK NC
VSS VSS
VSS
NC
NC NC
NC
L
DQH DQH VDDQ VDDQ VDD NC
VDD
VDDQ
VDDQ
DQA
DQA
M
DQH DQH VSS
VSS
VSS NC
VSS VSS
VSS
DQA DQA
N
DQH DQH VDDQ VDDQ VDD NC
VDD VDDQ VDDQ DQA DQA
P
DQH DQH VSS
VSS
VSS ZZ
VSS VSS
VSS
DQA DQA
R
DQPD DQPH VDDQ VDDQ VDD VDD
VDD
VDDQ
VDDQ DQPA DQPE
T
DQD DQD VSS
NC
NC MODE NC
NC
VSS
DQE DQE
U
DQD DQD NC/72M A
A
V
DQD DQD A
A
A
W
DQD DQD TMS
TDI
A
A
A
A1
A
A0
A
A
A
DQE DQE
A
A
DQE DQE
TDO
TCK
DQE DQE
Pin Definitions
Name
A0, A1, A
BWA, BWB, BWC,
BWD, BWE, BWF,
BWG, BWH
GW
BWE
CLK
CE1
I/O
Input-
Synchronous
Input-
Synchronous
Description
Address Inputs used to select one of the address locations. Sampled at the rising
edge of the CLK if ADSP or ADSC is active LOW, and CE1, CE2, and CE3 [2]are sampled
active. A1: A0 are fed to the two-bit counter.
Byte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes to
the SRAM. Sampled on the rising edge of CLK.
Input-
Synchronous
Input-
Synchronous
Input-
Clock
Input-
Synchronous
Global Write Enable Input, active LOW. When asserted LOW on the rising edge of
CLK, a global write is conducted (ALL bytes are written, regardless of the values on BWX
and BWE).
Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal
must be asserted LOW to conduct a byte write.
Clock Input. Used to capture all synchronous inputs to the device. Also used to
increment the burst counter when ADV is asserted LOW, during a burst operation.
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in
conjunction with CE2 and CE3 to select/deselect the device. ADSP is ignored if CE1 is
HIGH. CE1 is sampled only when a new external address is loaded.
Document #: 38-05350 Rev. *E
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