S25FL064P Datasheet, PDF (57/62 Pages) SPANSION – 64-Mbit CMOS 3.0 Volt Flash Memory with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus

19.2 WNF 008 — WSON 8-contact (6 x 8 mm) No-Lead Package
S25FL064P
PACKAGE
SYMBOL
e
N
ND
L
b
D2
E2
D
E
A
A1
K
L1
WNF008
MIN
NOM
MAX
1.27 BSC.
8
4
0.45
0.50
0.55
0.35
0.40
0.45
4.70
4.80
4.90
5.70
5.80
5.90
6.00 BSC
8.00 BSC
0.70
0.75
0.80
0.00
0.02
0.05
0.20 MIN.
0.00
---
0.15
NOTE
3
5
4
10
NOTES:
1. DIMENSIONING AND TOLERANCING CONFORMS TO
ASME Y14.5M - 1994.
2. ALL DIMENSIONS ARE IN MILLMETERS.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4 DIMENSION “b” APPLIES TO METALLIZED TERMINAL AND IS
MEASURED BETWEEN 0.15 AND 0.30mm FROM TERMINAL
TIP. IF THE TERMINAL HAS THE OPTIONAL RADIUS ON THE
OTHER END OF THE TERMINAL, THE DIMENSION “b”
SHOULD NT BE MEASURED IN THAT RADIUS AREA.
5 ND REFER TO THE NUMBER OF TERMINALS ON D SIDE.
6. MAX. PACKAGE WARPAGE IS 0.05mm.
7. MAXIMUM ALLOWABLE BURRS IS 0.076mm IN ALL DIRECTIONS.
8 PIN #1 ID ON TOP WILL BE LASER MARKED.
9 BILATERAL COPLANARITY ZONE APPLIES TO THE EXPOSED
HEAT SINK SLUG AS WELL AS THE TERMINALS.
10 A MAXIMUM 0.15mm PULL BACK (L1) MAY BE PRESENT.
g1015 \ 16-038.30 \ 07.21.11
Document Number: 002-00649 Rev. *I
Page 57 of 62