CY8C28243 Datasheet, PDF (55/63 Pages) Cypress Semiconductor – PSoC Programmable System-on-Chip

PRELIMINARY
CY8C28xxx
Packaging Information
This section illustrates the packaging specifications for the CY8C28xxx PSoC devices, along with the thermal impedances for each
package and the typical package capacitance on crystal pins.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
Packaging Dimensions
Figure 18. 20-Pin (210-Mil) SSOP
51-85077 *C
Document Number: 001-48111 Rev. *C
Page 55 of 63
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