MB39C604 Datasheet, PDF (33/36 Pages) Cypress Semiconductor – PSR topology in an isolated flyback circuit

15. Package Dimensions
8-pin plastic SOP
(FPT-8P-M02)
8-pin plastic SOP
(FPT-8P-M02)
*¹ 5.05–^+00..2205 .199–^+..000180
8
5
MB39C604
Lead pitch
Package width×
package length
Lead shape
Sealing method
Mounting height
Weight
1.27 mm
3.9 mm × 5.05 mm
Gullwing
Plastic mold
1.75 mm MAX
0.06 g
Note 1) *1 : These dimensions include resin protrusion.
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
0.22 –^+00..0073
.009 ⁺–.^.00⁰0¹3
1
1.27(.050)
*²3.90±0.30 6.00±0.20
(.154±.012) (.236±.008)
45°
0.40(.016)
4
0.44±0.08
(.017±.003)
0.13(.005) M
0.10(.004)
C _{2002-2012 FUJITSU SEMICONDUCTOR LIMITED F08004S-c-5-10}
Details of "A" part
1.55±0.20
(.061±.008)
(Mounting
height)
0.25(.010)
"A"
0~8°
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.15±0.10
(.006±.004)
(Stand off)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Document Number: 002-08441 Rev.*A
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