MB39C604 Datasheet, PDF (32/36 Pages) Cypress Semiconductor – PSR topology in an isolated flyback circuit

MB39C604
14. Recommended Mounting Condition [JEDEC Level3] Lead Free
14.1 Recommended Reflow Condition
Table 8. Recommended Reflow Condition
Items
Method
Times
Floor life
Floor life
condition
IR(Infrared Reflow) / Convection
3 times in succession
Before unpacking
From unpacking to reflow
In case over period of floor life(*1)
Contents
Please use within 2 years after production.
Within 7 days
Baking with 125°C+/-3°C for 24hrs+2hrs/-0hrs is required. Then please
use within 7 days. (Please remember baking is up to 2 times)
Between 5°C and 30°C and also below 60%RH required. (It is preferred lower humidity in the required temp range.)
*1: Concerning the Tape & Reel product, please transfer product to heatproof tray and so on when you perform baking.
Also please prevent lead deforming and ESD damage during baking process.
14.2 Reflow Profile
Figure 18. Reflow Profile
260°C Max. (J-STD-020D)
T_L to T_P : Ramp Up Rate
3°C/s Max.
T_S
: Preheat & Soak
150 to 200°C, 60 to 120s
T_P - t_P : Peak Temperature
260°C Down, within 30s
T_L - t_L : Liquidous Temperature
217°C, 60 to 150s
T_P to T_L : Ramp Down Rate
6°C/s Max.
Time 25°C to Peak
8min Max.
Temperature on the top of the package body is measured.
Document Number: 002-08441 Rev.*A
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