MB39C601 Datasheet, PDF (33/37 Pages) Cypress Semiconductor – High power factor in single conversion

MB39C601
3. Recommended manual soldering (partial heating method)
Item
Condition
Before opening
Within two years after manufacture
Storage period
Between opening and mounting
Within two years after manufacture
(No need to control moisture during the storage period
because of the partial heating method.)
Storage conditions
5°C to 30°C, 70% RH or less (the lowest possible humidity)
Mounting conditions
Temperature at the tip of a soldering iron: 400°C Max
Time: Five seconds or below per pin*
*: Make sure that the tip of a soldering iron does not come in contact with the package body.
4. Recommended dip soldering
Item
Condition
Mounting times
1 time
Before opening
Please use it within two years after manufacture.
Storage period
From opening and mounting
When the storage period after
opening was exceeded
Less than 14 days
Please process within 14 days
after baking (125°C ±3°C, 24H+ 2H/─0H) .
Baking can be performed up to two times.
Storage conditions
5°C to 30°C, 70% RH or less (the lowest possible humidity)
Mounting condition
Temperature at soldering tub: 260°C Max
Time: Five seconds or below
Document Number: 002-08393 Rev.*A
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