CY7C603XX_08 Datasheet, PDF (30/31 Pages) Cypress Semiconductor – enCoRe™ III Low Voltage

CY7C603xx
Thermal Impedances
Table 33. Thermal Impedances per Package
Package
28 SSOP
Typical θ_JA *
96 °C/W
Typical θ_JC
39 °C/W
32 QFN
22 °C/W
* T_J = T_A + Power x θ_JA
12 °C/W
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to
achieve good solderability.
Table 34. Solder Reflow Peak Temperature
Package
Minimum Peak Maximum Peak
Temperature*
Temperature
28 SSOP
240°C
260°C
32 QFN
240°C
260°C
*Higher temperatures may be required based on the solder
melting point. Typical temperatures for solder are 220±5°C
with Sn-Pb or 245±5°C with Sn-Ag-Cu paste. Refer to the
solder manufacturer specifications.
Ordering Information
The following table lists the CY7C603xx device’s key package features and ordering codes.
Table 35. CY7C603xx Device Key Features and Ordering Information
Ordering Part Number
Flash Size RAM Size SMP
IO
CY7C60323-PVXC
8K
512
No
24
CY7C60323-PVXCT
8K
512
No
24
CY7C60323-LFXC
8K
512
No
28
CY7C60323-LFXCT
8K
512
No
28
CY7C60323-LTXC
8K
512
No
28
CY7C60323-LTXCT
8K
512
No
28
CY7C60333-LFXC
8K
512
Yes
26
CY7C60333-LFXCT
8K
512
Yes
26
CY7C60333-LTXC
8K
512
Yes
26
CY7C60333-LTXCT
8K
512
Yes
26
Package Type
28-SSOP
28-SSOP Tape and Reel
32-QFN
32-QFN Tape and Reel
32-QFN Sawn
32-QFN Sawn Tape and Reel
32-QFN
32-QFN Tape and Reel
32-QFN Sawn
32-QFN Sawn Tape and Reel
Document #: 38-16018 Rev. *E
Page 30 of 31
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