CY27410 Datasheet, PDF (25/29 Pages) Cypress Semiconductor – RMS phase jitter: 1-ps max at 12-kHz to 20-MHz offset

CY27410
Packaging Information
This section illustrates the packaging specifications for the CY27410 device, along with the thermal impedances for each package.
Important Note The EPAD must be connected to ground to reduce the thermal resistance and for signaling ground.
Figure 41. 48-Pin QFN (7 × 7 × 1.00 mm) LT48D 5.5 x 5.5 EPAD (Sawn) Package Outline
001-45616 *E
For information on the preferred dimensions for mounting QFN packages, refer to the Cypress application note
AN72845 - Design Guidelines for Cypress Quad Flat No Extended Lead (QFN) Packaged Devices.
Solder Reflow Specifications
Table 23 shows the solder reflow temperature limits that must not be exceeded.
Table 23. Solder Reflow Specifications
48-pin QFN
Package
Maximum Peak Temperature (T_C)
260 C
Maximum Time above T_C – 5 °C
30 seconds
Document Number: 001-89074 Rev. *K
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